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AZ91D镁合金化学镀Ni-P的沉积机制
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北京市自然科学基金(2032009);航空科学基金(03H51016)


Deposition Mechanism of Eletroless Plating of Ni-P on AZ91D Magnesium Alloy
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    摘要:

    利用金相显微镜(OM)、扫描电子显微镜(SEM)及能谱(EDS)等分析测试手段,研究AZ91D镁合金上直接化学电镀Ni-P的沉积过程。结果表明:活化后的表面上不同位置处最初沉积Ni的过程不同。在活化后的块状物上,由于氟化物的溶解,Mg置换出Ni,因此最初“块状物”上只有Ni沉积,没有P。β相和α相边缘则是由于其电位较高,附近的Ni2+得到Mg失去少量电子后还原沉积出高催化活性的Ni核,催化了次亚磷酸钠还原沉积出P和Ni。

    Abstract:

    The deposition process of electroless plating of Ni-P on AZ91D magnesium alloy was investigated by metallographic microscope, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). Results show that the initial deposition mechanisms of Ni-P coating in different places of the activated surface are different. There is only nickel (Ni) deposition but no P on “massive object” generated after activation, mainly due to the dissolution of the fluorides and the replacement of Mg for Ni. For β phase and the edge of α phase, adjacent Ni2+ would gain a few electrons lost by Mg and be reduced because of electrochemical effect. The Ni nucleus with high catalytic activity provides the catalysis condition for the reduction of P and Ni.

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钱建刚,滕晓明,刘玉芬,黄 巍. AZ91D镁合金化学镀Ni-P的沉积机制[J].稀有金属材料与工程,2010,39(9):1593~1597.[Qian Jiangang, Teng Xiaoming, Liu Yufen, Huang Wei. Deposition Mechanism of Eletroless Plating of Ni-P on AZ91D Magnesium Alloy[J]. Rare Metal Materials and Engineering,2010,39(9):1593~1597.]
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  • 收稿日期:2009-09-15
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