The diffusion bonding capability between Zr41.25Ti13.75Cu12.5Ni10Be22.5 bulk metallic glass and pure Cu with and without interlayer was studied on a Gleeble3500 thermomechanical simulator. Good diffusion bonding joints without cracks and voids have been obtained under both conditions. Atomic diffusion at the interface was obviously observed using EDS and EPMA methods, while the diffusion zones were very narrow. The crystalline phases which were transformed from amorphous state accelerated the atomic diffusion at the interface.