This study is aimed to adopt the powder metallurgy method to prepare copper alloy series (Cu/AlN) nanocomposites with high strength and high conductivity. Optical microscopy, transmission electron microscopy, and scanning electron microscopy were used to examine the effect of different process conditions (temperature, pressure, repressing pressure, and resintering temperature) on the structure and mechanical properties of the composites. The results show that the density of the sample increases with the increase of pressure and sintering temperature. The Brinell hardness of the sample increases with the increase of repressing pressure, sintering temperature and AlN nanoparticle content. However, when AlN nanoparticle content is >0.5 wt%, the Brinell hardness of the composites decreases. The bending strength of the sample increases with the increase of repressing pressure and sintering temperature.