电子科技大学中山学院化学与生物系,电子科技大学微电子与固体电子学院,电子科技大学中山学院化学与生物工程学院,清华大学材料系,电子科技大学微电子与固体电子学院
TQ 630.7
National Science Foundation of China under grants of (61302044, 51302145) and Natural Science Foundation of Guangdong Province (S2012010010646) and Zhongshan Science and Technology Projects (20123A319)
Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology,Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute,Department of Materials Science and Engineering, Tsinghua University,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology
王悦辉,李志凌,谢辉,赵玉珍,李晶泽.固化工艺对树脂基导电胶电性能的影响[J].稀有金属材料与工程,2016,45(10):2524~2528.[WANG YUE HUI, Li zhiling, Xiehui, Yuzhan Zhao, LIJingze. Influence of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives[J]. Rare Metal Materials and Engineering,2016,45(10):2524~2528.]
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