The effect of concentrations of hydrogen peroxide (H2O2) and salicylic acid (SA) on the material removal rate (MRR) in slurries was investigated. The influence of H2O2 and SA on the corrosion behavior was studied by electrochemical methods and X-ray photoelectron spectroscopy (XPS). The surface roughness of the polished Ru disk was characterized by atomic force microscopy (AFM). The results show that the increase of SA promotes formation of passive film, and increases the MRR of Ru. MRR increases with the increasing of H2O2 at the beginning, but it would decrease when the concentration of H2O2 is higher than 3%. The surface roughness Ra of the polished Ru surface could reach 7.2 nm.