W–30Cu/(0-4) wt.% TiC composite powders were prepared by electroless plating with simplified pretreatment. The composite powders were formed by cold compaction under 400 MPa using tablet machine and green compactions were sintered at 1,300 °C for 1 h. Micromorphology of the original W and TiC powders, simple-treated W and TiC powders, and as-received W–30Cu/(0, 0.25, 0.5, 1, 2, 3, 4) wt.% TiC composite powders after electroless plating were characterized by field emission scanning electron microscopy (FE-SEM). Microstructures of the W–30Cu/(0, 0.25, 0.5, 1, 2, 3, 4) wt.% TiC composites were also investigated by FE-SEM. The effect of TiC content on the properties of W–30Cu/(0, 0.25, 0.5, 1, 2, 3, 4) wt.% TiC composites ( such as relative density, hardness, electrical conductivity, and compressive strength) were studied. Results showed that W–30Cu/TiC composite powders with uniform structure were obtained by simplified W and TiC powder pretreatment, followed by electroless copper plating. When TiC content was less than 1wt%, the compressive strength and hardness of composite materials obviously increased and the electrical conductivity of composite materials decreased with TiC content increased, respectively. However, the electrical conductivity of composite materials was still higher than that of the national standard value. Adding a certain amount of TiC content to W–30Cu/(0, 0.25, 0.5, 1, 2, 3, 4) wt.% TiC composites, the composite materials exhibited good comprehensive performance.