In this study, Ti-Al-Si-Cu-N films were deposited on the AISI-304 stainless steel by reactive magnetron sputtering technology. The influences of the substrate temperature on the microstructure and properties of the films were researched by scanning electron microscope（SEM），energy disperse spectroscopy（EDS）, X-ray diffraction （XRD）, a nano-indenter, a scratch tester and a ball-on-disc rotational tribometer. The results indicated that when the deposition temperature increased from room temperature to 250 oC, the films became smoother and denser. The hardness and elastic modulus increased with the increase of the deposition temperature. The scratch test showed that when the deposition temperatures were RT, 150 oC and 250 oC, the critical load of the films was 3.85 N, 3.45 N and 5.10 N, respectively. The friction coefficient and wear rate of the Ti-Al-Si-Cu-N film deposited at 250 oC were the smallest, and the wear debris was mainly from the counterparts GCr15 stainless balls, the wear mechanism of the films deposited at lower temperatures was mainly fatigue fracture and abrasive wear, while that of the film deposited at 250 oC was abrasive wear.