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石墨烯/SnO2/Cu复合材料微观组织及性能研究
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黑龙江省科学院高技术研究院

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TB331

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国家自然科学基金资助(项目号51401079);黑龙江省科技成果转化引导资金项目资助(项目号GC15F004);黑龙江省科学院青年创新基金资助(项目号CXMS2017GJS01)


Microstructure and properties of Graphene/SnO2/Cu-base composites
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Heilongjiang Provincial Academy of Sciences High-tech Institute

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    摘要:

    采用微波水热合成法对石墨烯进行表面改性,形成石墨烯/SnO2纳米复合物;将其用于粉末冶金法制备石墨烯/SnO2/Cu复合材料。采用多种分析测试手段对复合材料的微观组织及性能进行研究。结果表明,石墨烯表面吸附的SnO2纳米颗粒不会在复合材料制备过程中脱落,并可有效抑制石墨烯团聚,提高复合材料的致密度、硬度和热导率等性能。本文制备的石墨烯/SnO2/Cu复合材料致密度为91.0%,硬度为166HBW,热导率139W/(m℃),远高于Graphene/Cu复合材料。Graphene/SnO2/Cu复合材料中,界面结合良好,无开裂和界面反应;基体Cu中的刃型位错、形变孪晶以及石墨烯表面的SnO2纳米颗粒,是导致复合材料电导率下降的主要原因。

    Abstract:

    In this work, Graphene/SnO2 composites were prepared by hydrothermal synthesis method to modificate the surface of grapheme, which were then used to prepare Graphene/SnO2/Cu through powder metallurgy. Many different methods were used to measure and analysis the composites’ microstructure and properties. The results reveal that SnO2 nano-particles absorbing on the surface of grapheme will not shed during the process of preparation. At the same time, SnO2 particles can inhibit aggregation of graphene, and improve the composites’ density, hardness and thermal conductivity. Graphene/SnO2/Cu composites’ density is 91.0%, hardness is 166 HBW, and thermal conductivity is 139 W/ (m℃), which are more higher than Graphene/Cu composites. Graphene/SnO2/Cu composites’ bonding at the interface is well, with no crack or interfacial reaction. There are three main reasons that lead to the decrease of electrical conductivity of the composites, namely edge dislocation and deformation twin of copper matrix and SnO2 nano-particles on graphene’s surface.

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宋美慧,张煜,李艳春,王珏,张伟君,张晓臣.石墨烯/SnO2/Cu复合材料微观组织及性能研究[J].稀有金属材料与工程,2018,47(11):3559~3563.[Song Meihui, Zhang Yu, Li Yanchun, Wang Jue, Zhang Weijun, Zhang Xiaochen. Microstructure and properties of Graphene/SnO2/Cu-base composites[J]. Rare Metal Materials and Engineering,2018,47(11):3559~3563.]
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  • 收稿日期:2017-01-18
  • 最后修改日期:2017-03-22
  • 录用日期:2017-04-14
  • 在线发布日期: 2018-12-19
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