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钛合金仿莲房特征芯体夹层结构钎焊组织与性能
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中国航空制造技术研究院 航空焊接与连接技术航空科技重点实验室

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TG454

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航空科学基金资助(项目号2017ZE25)


Brazing interface microstructure and mechanical properties of titanium sandwich structure with lotus seedpod-like core
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Aeronautical Key Laboratory for Welding and Joining Technologies,AVIC Manufacturing Technology Institute

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    摘要:

    针对TC4钛合金仿莲房特征芯体与面板钎焊工艺,采用TiZrCuNi钎料,开展了钎焊工艺研究,并分析了主要钎焊工艺参数对钎焊界面组织和夹层结构力学性能的影响。结果表明:钎焊温度920℃,保温时间90min时, TC4钛合金仿莲房特征芯体夹层结构钎焊后界面焊合率良好,界面显微组织为均匀针状α组织和界面金属间化合物,夹层结构平压强度均值为15.14MPa。钎焊保温时间对TC4钛合金仿莲房特征芯体钎焊界面显微组织影响显著,当钎焊保温时间较短时(15min),钎料熔化后,液态钎料中Cu和Ni元素与母材反应时间较短,钎料中Cu和Ni向母材中的扩散反应不充分,钎缝区局部Cu和Ni元素富集导致Cu和Ni元素含量超过共晶成分点,钎焊保温结束后液态钎缝凝固时发生共晶反应,生成块状金属间化合物,钎焊界面主要为含有块状金属间化合物的凝固钎料组织和针状α组织;随着钎焊保温时间的增加,液态钎料中Cu和Ni元素与母材反应时间增加,钎料中Cu和Ni元素向母材中扩散反应深度显著增加,从而Cu和Ni元素在液态钎料中的含量显著降低,元素含量小于共晶成分点,钎焊保温结束后液态钎缝凝固时Cu和Ni元素固溶于β相中,避免大量块状金属化合物生成,随后β相向α相的固态相变时,共析反应生成针状α相,在针状α组织界面处生成金属间化合物。钎焊时间保温时间从15min升至90min时,由于钎焊界面金属间化合物减少,TC4钛合金仿莲房特征芯体夹层结构的平压强度逐渐增加。

    Abstract:

    TC4 titanium lotus-like core sandwich structure was brazed using TiZrCuNi brazing filler metal. Effect of brazing parameters on brazing interface microstructure and mechanical properties of titanium lotus-like core sandwich structure was investigated. Results show that titanium sandwich structure with excellent brazed quality is attained at the brazing temperature of 920 ℃ with the brazing time of 90 min. The microstructure of the brazing interface consists of acicular α structure and Ti-Cu intermetallic compounds, and the average flat compressive strength of the sandwich structure is 15.14mpa. When the brazing time is short (15min), the diffusion reaction time between Cu and Ni in the liquid solder and the base metal is short, and the diffusion reaction of Cu and Ni into the base metal is not sufficient. The enrichment of Cu and Ni in the brazing interface leads to the content of Cu and Ni exceeding the eutectic composition, which makes eutectic reaction occurred during the solidification process of liquid solder joint after brazing, and thus massive intermetallic compounds are formed. The brazing interface is mainly composed of solidified brazing filler metal containing massive intermetallic compounds and acicular α structure. With the increase of brazing time, the diffusion reaction time of Cu and Ni elements in liquid solder and base metal increases, and the diffusion reaction depth of Cu and Ni elements into base metal increases significantly. As a result, the content of Cu and Ni in the liquid solder decreases significantly, and the element content is less than the eutectic composition point. Cu and Ni are all dissolved in β phase during the solidification process of the liquid brazing seam. When the β phase changes to α phase, the acicular α phase is formed by eutectoid reaction, and intermetallic compound is formed at the interface of acicular α structure. When the brazing time increases from 15min to 90min, the flat compressive strength of TC4 titanium sandwich structure increases gradually due to the decrease of intermetallic compounds in the brazing interface.

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邓云华,王文森,陶军.钛合金仿莲房特征芯体夹层结构钎焊组织与性能[J].稀有金属材料与工程,2021,50(9):3218~3224.[Deng Yunhua, Wang Wensen, Tao Jun. Brazing interface microstructure and mechanical properties of titanium sandwich structure with lotus seedpod-like core[J]. Rare Metal Materials and Engineering,2021,50(9):3218~3224.]
DOI:10.12442/j. issn.1002-185X.20200764

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  • 收稿日期:2020-10-03
  • 最后修改日期:2021-01-17
  • 录用日期:2021-02-03
  • 在线发布日期: 2021-09-27
  • 出版日期: 2021-09-24