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不同电场环境对镀料脱靶方式及TiN镀层微观结构的影响
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西安理工大学

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国家自然科学基金资助(项目号51271144)


Effect of different electric field environment on the leave-target mechanism of plating material and the microstructure of TiN coatings
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    摘要:

    当前主流的镀层沉积技术中,电弧离子镀因镀料熔融喷溅脱靶致镀料中夹杂微米尺度高温颗粒,易使镀层表面粗糙和基体高温损伤;直流磁控溅射因镀料碰撞溅射脱靶致离化率低,易使镀层厚度不均和组织疏松。为解决以上技术缺点,依据气体放电等离子体物理学知识,采用新型阶梯式双级脉冲电场诱发阴极靶材与阳极腔体间气体微弧放电,依靠微弧放电后产生的高密度等离子体,增强Ar+对靶面的轰击动能和靶面产生的焦耳热,实现镀料由碰撞溅射脱靶向热发射脱靶的转变,并以此提高镀料的离化率,达到改善镀层结构的目的。实验结果表明:双级脉冲电场诱发的气体微弧放电呈现出耀眼白光,而靶面形貌则表现出高低起伏的凹坑和水流波纹,其靶面形貌不同于镀料碰撞溅射脱靶后的多边形凹坑,说明靶面局部区域的镀料以热发射方式脱靶。同时,在双级脉冲电场下制备的TiN镀层具有较为致密的组织结构,沉积速率可达51nm/min。

    Abstract:

    The plating materials of arc ion plating leaved target by melt splash. It is easy to cause secondary tempering of the matrix because of micron sized particles on the coating surface. The ionization rateofmagnetron sputtering is low due to the leave-target mode of cascade collision. The deposition rate of high power pulsed magnetron sputtering is low due to the small duty cycle of pulse discharge. These defects seriously restrict the wide application of current mainstream coating deposition technology.Based on the physical knowledge of gas discharge plasma, a new type of stepped dual-stage pulsed electric field was used to initiate gas micro arc discharge between cathode target and anode chamber. With the help of the high density plasma produced by micro arc discharge, the kinetic energy of argon ion bombardment on the target surface and the Joule heat generated by the target surface are enhanced. The collision enhanced thermal emission of the plating material can be realized, and the ionization rate is increased, which provides the possibility for improving and regulating the coating structure. The results showed that the gas micro arc discharge induced by dual-stage pulsed electric field presents dazzling blue and white light. The surface morphology of the target surface after discharge showed the morphology of meteorite crater and water flow crater. The target surface morphology was not exactly the same as the undulating crater left after the collision sputtering of the plating material under DC electric field. The the plating material leaved target by collision sputtering and thermal emission. At the same time, the TiN coating prepared by the dual-stage pulsed electric field had a relatively compact structure, and the deposition rate reached 51 nm/min, which is significantly improved compared with the traditional high power pulsed magnetron sputtering.

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杨超,郝娟.不同电场环境对镀料脱靶方式及TiN镀层微观结构的影响[J].稀有金属材料与工程,2021,50(11):4059~.[Yang Chao, Hao Juan. Effect of different electric field environment on the leave-target mechanism of plating material and the microstructure of TiN coatings[J]. Rare Metal Materials and Engineering,2021,50(11):4059~.]
DOI:10.12442/j. issn.1002-185X.20200882

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  • 收稿日期:2020-11-16
  • 最后修改日期:2020-12-15
  • 录用日期:2020-12-23
  • 在线发布日期: 2021-11-30
  • 出版日期: 2021-11-24