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高熔点差三元合金累积叠轧-扩散合金化制备工艺
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1.北京科技大学;2.北京材料基因工程高精尖创新中心 北京科技大学 北京 北京科技大学现代交通金属材料与加工技术北京实验室 北京科技大学 北京

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基金项目:

国家重点研发计划(项目号2018YFA0707300),国家自然科学基金(项目号51904029、52127802)


High difference melting point of ternary alloy by accumulative roll bonding-diffusion alloying preparation process
Author:
Affiliation:

1.北京科技大学;2.Beijing Advanced Innovation Center for Materials Genome Engineering,University of Science and Technology Beijing,Beijing,ChinaBeijing Laboratory of Metallic Materials and Processing for Modern Transportation,University of Science and Technology Beijing,Beijing,China

Fund Project:

The National Key Technologies R&D Program of China, The National Natural Science Foundation of China

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    摘要:

    为解决高熔点差多元合金制备方法存在的元素偏析、合金性能受限、制备成本高等问题,提出了高熔点差组元合金的累积叠轧-扩散合金化制备新工艺。采用SEM、EDS、TEM、XRD和万能试验机表征了累积叠轧-扩散合金化Cu-21Ni-5Sn合金的组织和性能,研究了累积叠轧和阶梯式扩散热处理工艺对Cu-21Ni-5Sn合金成分均匀性的影响和机理,并揭示了后续时效制度对Cu-21Ni-5Sn合金性能的影响和机理。结果表明:通过累积叠轧7道次+650 ℃/5 h+1000 ℃/8 h阶梯真空扩散热处理工艺,制备出了元素误差小于5%、成分均匀的Cu-21Ni-5Sn合金。采用累积叠轧实现减薄中间层、缩短扩散距离,增加晶界、位错等原子扩散通道,低熔点Sn元素与Cu、Ni元素在650 ℃形成高熔点(Cu,Ni)3Sn金属间化合物临界层,在1000 ℃高温加速Cu、Ni元素扩散。Cu-21Ni-5Sn合金在40%预冷变形下于470 ℃时效60 min充分调幅分解,基体中析出致密的与基体共格的DO22及L12有序固溶体,与α铜基体之间的取向关系为(-1-1-1 )Cu//(-2-20)DO22,(-200)Cu//(-310)L12。合金抗拉强度达到峰值916 MPa,弹性模量为135.4 GPa,合金导电率达到6.23% IACS。

    Abstract:

    In order to solve the problems of elemental segregation, limited properties and high cost in the preparation of high difference of multi-alloys melting point, a new process of accumulative roll bonding (ARB)-diffusion alloying (DA) has been developed. The properties of the ARB-DA Cu-21Ni-5Sn alloy were characterized by SEM, EDS, TEM, XRD and the universal testing machine. The effects and mechanisms of the ARB and step diffusion heat treatment processes on the compositional homogeneity of the Cu-21Ni-5Sn alloy were investigated, and the effects and mechanisms of the subsequent aging regime on the properties of the Cu-21Ni-5Sn alloy were revealed. The results show that Cu-21Ni-5Sn alloy with less than 5% elemental error and homogeneous composition was prepared by ARB 7 passes + 650 ℃/5 h + 1000 ℃/8 h step vacuum diffusion heat treatment process. The Cu-21Ni-5Sn alloy was aged at 470 ℃ for 60 min under 40% pre-cooling deformation for 60 min to fully spinodal decomposition. Dense DO22 and L12 ordered solid solution with matrix with α-Cu matrix was(-1-1-1 )Cu//(-2-20)DO22, (-200)Cu//(-310)L12. The alloy reached tensile strength of 925 MPa, a modulus of elasticity of 135.4 GPa, and an alloy conductivity of 6.23% IACS.

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王文静,冯启航,刘雪峰,涂英明.高熔点差三元合金累积叠轧-扩散合金化制备工艺[J].稀有金属材料与工程,2023,52(8):2765~2774.[WANG Wenjing, FENG Qihang, LIU Xuefeng, TU Yingming. High difference melting point of ternary alloy by accumulative roll bonding-diffusion alloying preparation process[J]. Rare Metal Materials and Engineering,2023,52(8):2765~2774.]
DOI:10.12442/j. issn.1002-185X.20220994

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  • 收稿日期:2022-12-21
  • 最后修改日期:2023-02-21
  • 录用日期:2023-03-13
  • 在线发布日期: 2023-08-28
  • 出版日期: 2023-08-24