The microstructure of high-purity copper targets has a significant impact on the quality of sputtered films. This study investigates the evolution of the microstructure and dynamic recrystallization mechanism of copper targets from the perspective of hot working. The hot deformation behavior of high-purity copper at temperatures ranging from 500 to 650°C and strain rates of 0.01 to 10 s-1 was studied through isothermal compression experiments. The results show that the evolution of the microstructure and the recrystallization mechanism are closely related to the Zener-Hollomon parameter. As the temperature increases and the strain rate decreases, the lnZ decreases, and the average grain size decrease, both the microstructure homogenize and dynamic recrystallization enhance, and the texture transitions from a strong deformation texture of CubeND{001}<110> to Cube{001}<100> and Goss{011}<100>. The dynamic recrystallization mechanism changes at different lnZ values. Local recrystallization occurs at high lnZ values, which is a discontinuous dynamic recrystallization (DDRX) mode. At middle lnZ value, the degree of recrystallization increases, the orientation difference increases uniformly and the lattice rotates gradually. At low lnZ values, continuous dynamic recrystallization (CDRX) of progressive rotation of lattice and geometric dynamic recrystallization (GDRX) of grain "pinching" occur, at low lnZ value of 650℃, 10s-1, homogeneous fine microstructure and weak texture strength are obtained. The research can provide theoretical guidance for the optimization of hot working technology of high purity metal sputtering targets.