In order to analyze the material removal mechanism of single crystal γ-TiAl alloy in grinding, the molecular dynamics model of Ti-Al alloy ground by two abrasive grains was established. The influence of lateral and longitudinal spacing of the diamond abrasive on the material removal mechanism of the single crystal γ-TiAl alloy was revealed. The results showed that the microcutting process of single crystal γ-TiAl alloy is accompanied by the change of temperature, potential energy and dislocation, as well as lattice phase transition. Cutting force, cutting temperature, potential energy and removal efficiency increase with the increase of lateral spacing, but are less affected by longitudinal spacing. The number of lattice phase transition atoms increases with the increase of lateral spacing and decreases with the increase of longitudinal spacing. With the increase of laterial and longitudinal spacing, the number of dislocations, total length of dislocations, and density of dislocations will increase accordingly.