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首页 > 过刊浏览>2022年第51卷第7期 >2393-2399. DOI:10.12442/j.issn.1002-185X.E20210018
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电镀辅助热等静压扩散连接钨/钢接头的特征
作者:
作者单位:

1.中南大学 轻质高强结构材料国家级重点实验室，湖南 长沙 410083;2.西安交通大学 金属材料强度国家重点实验室，陕西 西安 710049

基金项目:

State Key Laboratory for Mechanical Behavior of Materials(Grant no. 51701242)，the National Natural Science Foundation of China(Grant no. 51931012)


Characterization of Diffusion Bonded W/Steel Joint by Electroplating-Assisted Hot Isostatic Pressing
Author:
Affiliation:

1.National Key Laboratory of Science and Technology on High-Strength Structural Materials, Central South University, Changsha 410083, China;2.State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China

Fund Project:

Sponsored by State Key Laboratory for Mechanical Behavior of Materials (20202214); National Natural Science Foundation of China (51931012)

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    摘要:

    采用电化学沉积技术在纯钨圆柱表面上电镀了厚度为10 μm的Ni镀层，再利用热等静压扩散连接方法制备可应用于核聚变堆部件的钨/钢圆柱体连接试样。热等静压扩散连接工艺参数设定为900 ℃/100 MPa/1 h。由组织和成分分析可知钨/钢扩散连接接头形成了良好的冶金结合，其接头抗拉伸强度约为236 MPa，但由于残余应力集中，钨/钢接头断裂失效发生在靠近连接界面的钨基体内。实验加入Cu作为软质中间层，通过蠕变或者屈服机制释放残余应力，使得钨/钢接头强度提高到312 MPa。同时分析了镀层的结合力和钨/钢连接接头界面的硬度分布。

    Abstract:

    The Ni coating of 10 μm in thickness was firstly deposited on the cylinder surface of pure tungsten by electrochemical deposition, and then the W/steel joint cylinders were prepared by the hot isostatic pressing (HIP) diffusion bonding process for nuclear component application. The HIP bonding parameters were set as 900 °C/100 MPa/1 h. The structure and composition analyses show that the metallurgical bonds are achieved with a tensile strength of about 236 MPa. However, the W/steel joint fractures at W substrate near the bonding interface due to the residual stress concentration. The Cu addition was used as the soft intermediate layer to release the residual stress by creep or yield mechanism, thereby improving the tensile strength of W/steel joint to about 312 MPa. The adhesive force of coating and the hardness distribution in the bonding interfaces were also discussed.

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马运柱,王健宁,刘文胜,戴正飞,蔡青山.电镀辅助热等静压扩散连接钨/钢接头的特征[J].稀有金属材料与工程,2022,51(7):2393~2399.[Ma Yunzhu, Wang Jianning, Liu Wensheng, Dai Zhengfei, Cai Qingshan. Characterization of Diffusion Bonded W/Steel Joint by Electroplating-Assisted Hot Isostatic Pressing[J]. Rare Metal Materials and Engineering,2022,51(7):2393~2399.]
DOI：10.12442/j. issn.1002-185X. E20210018

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  • 收稿日期:2021-06-07
  • 最后修改日期:2021-09-18
  • 录用日期:2021-09-27
  • 在线发布日期: 2022-08-03
  • 出版日期: 2022-07-27

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