Cu/Mo/Cu(CMC)laminate is a new kind of composite with highl electrical conductivity and thermal conductivity. Especially, the CTE(coefficient of thermal expansion) of the laminate can be tailored by changing the cladding ratio, so a significant amount of CMC sheet is used in electronic industry for substrates of integrated circuits. At present, it is an ideal material to replace the pure molybdenum sheet. In this study, CMC laminate was produced with explosive cladding technique. The interface's morphology and microstructure were observed by means of OM. SEM. Microhardness measurements revealed the feature of deformation zone.