Silver nanoparticles modified by silane coupling agent KH-560 were used as conductive filler to prepare conductive adhesive at 180 ℃ in epoxide resin vehicles. The as-modified Ag nanoparticles and conductive adhesive were characterized by transmission electron microscopy (TEM), Fourier transform infrared spectra (FTIR) and differential scanning calorimetry (DSC). The effects of silver content and curing time on the properties of conductive adhesive were studied. The results show that KH-560 modified Ag powders with a particle size of approximately 20 nm are uniformly dispersed and KH-560 molecules are adsorbed on silver particle surface. Silver content and curing time could influence the properties of conductive adhesive significantly. The bulk resistivity of conductive adhesive with 55 wt% silver nanoparticle and curing time of 15 min reaches a minimal value of 2.5×10-3 ?·cm. Compared with the conductive adhesive filled with unmodified silver nano-powders, the bulk resistivity of conductive adhesive filled with modified silver nano-powders increases by 3-5 times.