王宇,金洙吉.无氰脉冲电镀金-钯-铜合金工艺[J].稀有金属材料与工程,2016,45(1):171~176.[wangyu,jinzhuji.Non-cyanide Pulse Electroplating Process for Au-Pd-Cu Alloy[J].Rare Metal Materials and Engineering,2016,45(1):171~176.]
无氰脉冲电镀金-钯-铜合金工艺
投稿时间:2013-12-25  修订日期:2014-01-08
中文关键词:  无氰脉冲电镀  表面形貌  沉积速率  工艺参数
基金项目:
中文摘要:
      研究了一种以亚硫酸钠为主配位剂的无氰脉冲电镀金-钯-铜合金工艺。综合考虑镀层表面形貌和镀液沉积速率,得出优选电镀工艺参数为:电流密度0.25A/dm2、占空比10%、脉冲频率900Hz、电镀温度60℃。利用超景深显微镜对镀层表面形貌进行观察分析;利用X射线衍射对镀层物相成分进行分析;同时采用热震法、弯折法检测了镀层结合力;利用维式硬度计测量了镀层硬度。表征结果表明:所得镀层除金、钯、铜元素外,无其它杂质元素;镀层表面细致均匀,孔隙率低,平整性好,无裂纹;镀层硬度高,镀层结合力好。
Non-cyanide Pulse Electroplating Process for Au-Pd-Cu Alloy
英文关键词:non-cyanide pulse electroplating  surface morphology  deposition rate  parameters
英文摘要:
      A non-cyanide sulfite bath pulse electroplating process for Au-Pd-Cu alloy was investigated. Thinking about the coating’s surface morphology and the plating’s deposition rate, the optimized electroplating parameters were found as follows: current density 0.25A/dm2, duty ratio 10%, pulse frequency 900Hz, temperature 60℃. Tra-depth microscope was used to observe coating’s surface morphology, and X-ray diffraction was used to analyze the phase components. Meanwhile, the coating’s binding force was tested by means of thermal shock test and root bend test.Furthermore, the coating’s hardness was meatured by Vickers. The results showed that there were only Au, Pd and Cu in the coating without any impurity elements and the coating had fine and uniform grains, with high hardness, excellent adhesion, low porosity, good smoothness and free of cracks.
作者单位E-mail
王宇 大连理工大学 356916452@qq.com 
金洙吉 大连理工大学 kimsg@dlut.edu.cn 
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