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无氰脉冲电镀金-钯-铜合金工艺
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大连理工大学

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TQ153.2

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Non-cyanide Pulse Electroplating Process for Au-Pd-Cu Alloy
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Dalian University of Technology

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    摘要:

    研究了一种以亚硫酸钠为主配位剂的无氰脉冲电镀金-钯-铜合金工艺。综合考虑镀层表面形貌和镀液沉积速率,得出优选电镀工艺参数为:电流密度0.25A/dm2、占空比10%、脉冲频率900Hz、电镀温度60℃。利用超景深显微镜对镀层表面形貌进行观察分析;利用X射线衍射对镀层物相成分进行分析;同时采用热震法、弯折法检测了镀层结合力;利用维式硬度计测量了镀层硬度。表征结果表明:所得镀层除金、钯、铜元素外,无其它杂质元素;镀层表面细致均匀,孔隙率低,平整性好,无裂纹;镀层硬度高,镀层结合力好。

    Abstract:

    A non-cyanide sulfite bath pulse electroplating process for Au-Pd-Cu alloy was investigated. Thinking about the coating’s surface morphology and the plating’s deposition rate, the optimized electroplating parameters were found as follows: current density 0.25A/dm2, duty ratio 10%, pulse frequency 900Hz, temperature 60℃. Tra-depth microscope was used to observe coating’s surface morphology, and X-ray diffraction was used to analyze the phase components. Meanwhile, the coating’s binding force was tested by means of thermal shock test and root bend test.Furthermore, the coating’s hardness was meatured by Vickers. The results showed that there were only Au, Pd and Cu in the coating without any impurity elements and the coating had fine and uniform grains, with high hardness, excellent adhesion, low porosity, good smoothness and free of cracks.

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王宇,金洙吉.无氰脉冲电镀金-钯-铜合金工艺[J].稀有金属材料与工程,2016,45(1):171~176.[wangyu, jinzhuji. Non-cyanide Pulse Electroplating Process for Au-Pd-Cu Alloy[J]. Rare Metal Materials and Engineering,2016,45(1):171~176.]
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历史
  • 收稿日期:2013-12-25
  • 最后修改日期:2014-01-08
  • 录用日期:2014-01-20
  • 在线发布日期: 2019-01-04
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