齐艳飞,王波,周景一,李运刚,田薇.W-Ni-Cu功能梯度材料的制备及性能研究[J].稀有金属材料与工程,2017,46(12):3893~3896.[QI Yanfei,WANG Bo,ZHOU Jingyi,LI Yungang,TIAN Wei.Study on the preparation and properties of W-Ni-Cu functionally gradient materials[J].Rare Metal Materials and Engineering,2017,46(12):3893~3896.]
W-Ni-Cu功能梯度材料的制备及性能研究
投稿时间:2015-10-13  修订日期:2016-03-16
中文关键词:  W-Ni-Cu 梯度材料  结合性能  导热性
基金项目:国家自然科学基金资助项目(51274082);ITER计划专项项目(2013GB109003)
中文摘要:
      采用熔盐电沉积与水溶液电沉积工艺制备了W-Ni-Cu复合材料。经800 ℃依次保温60 min、120 min、180 min退火后,可获得梯度层厚度分别为25 μm、35 μm、45 μm的W-Ni-Cu梯度材料,其中Ni起到桥接W和Cu的作用。试样经热冲击和热疲劳试验处理后,表面无突起、裂纹或脱落现象,说明镀层与基体之间具有良好的冶金结合性能。导热性试验表明,在25~800 ℃范围内,纯W板和W-Ni-Cu梯度材料的导热系数随温度升高而降低;相同温度下,纯W板的导热系数比W-Ni-Cu梯度材料的导热系数大,且W-Ni-Cu梯度材料的导热系数随梯度层厚度升高而降低。
Study on the preparation and properties of W-Ni-Cu functionally gradient materials
英文关键词:W-Ni-Cu functional graded material  bonding properties  thermal conductivity
英文摘要:
      W-Ni-Cu compound materials were?obtained?by?using?fused-salt?electrolysis?method?and?aqueous?solution?electrolysis?method. W-Ni-Cu?functional?graded?materials?(FGM)?characterized?with?different?thickness?(25 μm,?35 μm?and?45 μm) were obtained from its compound materials after annealing at?800 ℃ for?60min,?120min?and?180min, respectively, Ni plays a role in bridging Cu and W. Cracks and abscission were not presented?in?the?surface?of?samples?after?thermal?shock?and?thermal?fatigue,?which?indicates?the?material?has?good?bonding?properties. Thermal ?conductivity?tests?were?also?conducted,?the?result?shows?that?the?thermal?conductivity?of?pure?W?plate?and?W-Ni-Cu FGM decrease with increasing temperature (25~800 ℃). The thermal conductivity of pure W plate is higher than that of W-Ni-Cu FGM at the same temperature. The thermal conductivity of W-Ni-Cu FGM decreases with increasing gradient thickness.
作者单位E-mail
齐艳飞 北京工业大学 qyf999fyq@163.com 
王波 北京工业大学  
周景一 华北理工大学  
李运刚 华北理工大学 lyg@heut.edu.cn 
田薇 华北理工大学  
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