W-Ni-Cu compound materials were?obtained?by?using?fused-salt?electrolysis?method?and?aqueous?solution?electrolysis?method. W-Ni-Cu?functional?graded?materials?(FGM)?characterized?with?different?thickness?(25 μm,?35 μm?and?45 μm) were obtained from its compound materials after annealing at?800 ℃ for?60min,?120min?and?180min, respectively, Ni plays a role in bridging Cu and W. Cracks and abscission were not presented?in?the?surface?of?samples?after?thermal?shock?and?thermal?fatigue,?which?indicates?the?material?has?good?bonding?properties. Thermal ?conductivity?tests?were?also?conducted,?the?result?shows?that?the?thermal?conductivity?of?pure?W?plate?and?W-Ni-Cu FGM decrease with increasing temperature (25～800 ℃). The thermal conductivity of pure W plate is higher than that of W-Ni-Cu FGM at the same temperature. The thermal conductivity of W-Ni-Cu FGM decreases with increasing gradient thickness.