应丽霞,李正辉,吴珂,吕秀鹏,王桂香.TiO2溶胶对Cu-Sn镀层微观组织结构和性能的影响研究[J].稀有金属材料与工程,2017,46(10):2801~2806.[Ying Lixia,Li Zhenghui,Wu Ke,Lv Xiupeng,Wang Guixiang.Study on the Effect of TiO2 Sol on the Microstructure and Tribological Properties of Cu-Sn Coating[J].Rare Metal Materials and Engineering,2017,46(10):2801~2806.]
TiO2溶胶对Cu-Sn镀层微观组织结构和性能的影响研究
投稿时间:2015-11-02  修订日期:2016-05-17
中文关键词:  电镀  Cu-Sn  TiO2溶胶  摩擦学性能
基金项目:国家自然科学基金项目(面上项目,重点项目,重大项目)
中文摘要:
      为了进一步提高Cu-Sn镀层的硬度和耐磨性,在保持镀层自润滑性能的基础上,采用纳米溶胶技术与复合电镀技术相结合的方法,将纳米TiO2溶胶加入到电解液,制备获得TiO2纳米粒子强化的Cu-Sn-TiO2复合镀层。通过对显微硬度、摩擦学性能和微观组织结构的分析表明,适量纳米TiO2溶胶的加入,细化了Cu-Sn镀层组织,提高了镀层的致密性,硬度和耐磨性均较Cu-Sn镀层显著提高。
Study on the Effect of TiO2 Sol on the Microstructure and Tribological Properties of Cu-Sn Coating
英文关键词:electrodeposition  Cu-Sn  TiO2 Sol  tribological property
英文摘要:
      In order to improve the hardness and wear resistance, ensure the self-lubricating property, Cu-Sn coatings were prepared and strengthened by combining sol-gel method and composite electroplating technology. In the paper, TiO2 Sol was added to the Cu-Sn electroplating bath to obtain nano-particles enhanced Cu-Sn-TiO2 composite coatings. The micro-structure, microhardness and tribological properties were analyzed in detail. The results show that the introduction of the TiO2 Sol in the plating solution leads to change the composition and structure of the composite coatings. The co-deposited TiO2 is uniformly distributed in the Cu-Sn matrix and contributes greatly to improve the microhardness and tribological properties of the Cu-Sn alloy coating.
作者单位E-mail
应丽霞 哈尔滨工程大学机电工程学院 yinglixia@hrbeu.edu.cn 
李正辉 哈尔滨工程大学机电工程学院  
吴珂 哈尔滨工程大学机电工程学院  
吕秀鹏 哈尔滨工程大学机电工程学院  
王桂香 哈尔滨工程大学材料与化学工程学院  
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