王云龙,段凯悦,王开坤,戴志刚,薛志红.放电等离子烧结法和热压法制备的镀钛金刚石/铜多层复合材料的结构和热性能[J].稀有金属材料与工程,2018,47(7):2011~2016.[Wang Yunlong,Duan Kaiyue,Wang Kaikun,Dai Zhigang,Xue Zhihong.Structure and thermal properties of layered Ti-clad diamond/Cu composites prepared by SPS and HP[J].Rare Metal Materials and Engineering,2018,47(7):2011~2016.]
放电等离子烧结法和热压法制备的镀钛金刚石/铜多层复合材料的结构和热性能
投稿时间:2016-11-30  修订日期:2017-03-07
中文关键词:  镀钛金刚石/铜复合材料  热压法  放电等离子烧结法  热性能
基金项目:国家自然科学基金项目(Nos. 51174028, 51541406)
中文摘要:
      用于电子封装领域的多层镀钛金刚石/铜复合材料通过放电等离子烧结技术(SPS)和热压法(HP)分别制备获得。通过扫描电子显微镜(SEM)确认了复合材料的结构,同时热导率(TC)和热膨胀系数(CTE)等热性能参数也进行了分析。层状复合材料的热导率理论值参考改良的哈塞尔曼-约翰逊(HJ)模型,同时考虑TiC界面的影响计算,结果为446.66 W?m-1K-1,而热膨胀系数则通过热膨胀仪测试确定。结果显示,经放电等离子烧结的试样与经热压制备的试样相比,缺陷相对较少,界面的结合对于复合材料热导率的影响十分明显。本文提出了一个界面影响的模型示意图,热导率随着碳化物层的厚度增加和气孔的出现而减小。由此可见,实现高热导率的条件是复合材料中的碳化物层较薄同时没有气孔的出现。
Structure and thermal properties of layered Ti-clad diamond/Cu composites prepared by SPS and HP
英文关键词:Ti-clad  diamond/Cu  composites, hot  pressing, spark  plasma sintering, thermal  properties
英文摘要:
      Layered Ti-clad diamond/Cu composites used in electronic packaging were prepared by spark plasma sintering (SPS) and hot pressing (HP), respectively. The structure was determined by Scanning Electron Microscopy (SEM) and the thermal properties, including the thermal conductivity (TC) and the coefficient of thermal expansion (CTE) were analyzed. The theoretical TC of the layered composites (446.66 W.m-1K-1) was calculated by the modified Hasselman and Johnson (HJ) model considering the influence of the TiC interface and the CTE was determined by dilatometer. The results show that the sample of SPS has fewer defects than that of HP and the interfacial bonding affects the TC of the composites significantly. A schematic graph of the interface influences is proposed and the TC decreases with the increasing thickness of carbide layer and air pores. In this regard, the composites with a thin carbide layer and no air pores should be processed to achieve a high TC.
作者单位E-mail
王云龙 北京科技大学 材料科学与工程学院 ylwang@xs.ustb.edu.cn 
段凯悦 北京科技大学 材料科学与工程学院  
王开坤 北京科技大学 材料科学与工程学院 kkwang@mater.ustb.edu.cn 
戴志刚 天津市鼎诚铝压铸件有限公司 tjbhzz@126.com 
薛志红 天津市鼎诚铝压铸件有限公司 missxue818@126.com 
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