马小波,张胜楠,于泽明,刘国庆,焦磊,郑会玲,李成山,张平祥,李金山.降温速率对Bi-2223/AgAu带材微观结构和传输性能的影响[J].稀有金属材料与工程,2019,48(6):1814~1818.[Ma Xiaobo,Zhang Shengnan,Yu Zeming,Liu Guoqing,Jiao Lei,Zheng Huiling,Li Chengshan,Zhang Pingxiang,Li Jinshan.Effects of cooling rate on the microstructures and transport properties of AgAu sheathed Bi-2223 tapes[J].Rare Metal Materials and Engineering,2019,48(6):1814~1818.]
降温速率对Bi-2223/AgAu带材微观结构和传输性能的影响
投稿时间:2018-01-03  修订日期:2018-01-16
中文关键词:  高温超导  (Bi, Pb)-2223/AgAu 带材  降温速率  微观结构  临界电流密度
基金项目:国家磁约束核聚变能发展计划
中文摘要:
      采用PIT工艺制备了单芯Bi-2223/AgAu带材,系统地研究了第二次热处理阶段(HT2)降温速率对带材相组成、微观结构和传输性能的影响。结果表明:随着降温速率的减小,富铅相3321不断增加,CuO颗粒尺寸逐渐增大。当冷却速率从600°C/h减小到1°C/h时,临界电流密度Jc从7 kA/cm2增加到11.5 kA/cm2,增加了64%。由于晶间连接性能和磁通钉扎性能的提高,在较低的降温速率下,Bi-2223/AgAu带材在磁场下的临界电流密度也得到了提高。
Effects of cooling rate on the microstructures and transport properties of AgAu sheathed Bi-2223 tapes
英文关键词:High temperature superconductor  (Bi, Pb)-2223/AgAu tapes  Cooling rate  microstructure  critical current density
英文摘要:
      Monofilament AgAu sheathed Bi-2223 tapes were fabricated by powder in tube (PIT) process. The influences of cooling rate during the second heat treatment process (HT2) on the phase composition, microstructures and transport properties of Bi-2223/AgAu tapes were systematically investigated. It was noticed that after the HT2 process, the content of Pb-rich Pb3Sr2.5Bi0.5Ca2CuOy (3321) phase increased with the decreasing cooling rate, while the size of CuO phase particles became bigger. With the cooling rate decreasing from 600 °C /h to 1 °C /h, the critical current density, Jc increased from 7 kA/cm2 to the maximum value of 11.5 kA/cm2, which increased for 64%. Meanwhile the current capacities in magnetic field of these Bi-2223/AgAu tapes have also been enhanced with slow cooling process, attributed to the improvements of both the intergrain connectivity and the flux pinning properties.
作者单位E-mail
马小波 西北工业大学 yequ198508@163.com 
张胜楠 西北有色金属研究院  
于泽明 西北有色金属研究院  
刘国庆 西北有色金属研究院  
焦磊 西北有色金属研究院  
郑会玲 西北有色金属研究院  
李成山 西北有色金属研究院  
张平祥 西北工业大学 yequ198508@163.com 
李金山 西北工业大学  
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