黄宇宽,徐顺涛),甘国友),李文琳),李俊鹏).低温固化电子浆料高导热性能研究进展[J].稀有金属材料与工程,2019,48(10):3394~3400.[Huang Yu-Kuan),Xu Shun-Tao),Gan Guo-You),Li Wen-Lin),Li Jun-Peng).Recent progress of high thermal conductivity of low temperature curing electronic paste[J].Rare Metal Materials and Engineering,2019,48(10):3394~3400.]
低温固化电子浆料高导热性能研究进展
投稿时间:2018-06-04  修订日期:2018-07-10
中文关键词:  电子浆料  纳米银  碳纳米管  导热性能
基金项目:国家自然科学基金(51771084);云南省科技计划项目(2016DC032);,
中文摘要:
      电子浆料作为一种性能优异的热界面材料,广泛应用于超高速电脑芯片、功率半导体器件以及高亮度LED中,可以通过低温固化方式实现芯片与热沉之间的机械连接、电连接和热连接并能满足高温环境下的使用要求。本文介绍了纳米银和碳纳米管应用于低温固化电子浆料提高导热性能的最新研究进展,基于二者对电子浆料导热结构的影响分别介绍了:1)纳米银尺寸、表面包覆剂以及烧结结构内部孪晶的形成对电子浆料导热性能的影响;2)制备定向碳纳米管阵列以及阵列连接界面改性修饰,在芯片与热沉之间形成高导热通路制备热界面材料; 3) 银修饰碳纳米管的界面效应以及其与银粉烧结键合形成三维复合导热结构对提升电子浆料导热性能的影响。并对未来纳米银与碳纳米管提高电子浆料导热性能的发展方向进行了展望。
Recent progress of high thermal conductivity of low temperature curing electronic paste
英文关键词:electronic paste  silver nanoparticles  carbon nanotubes  thermal conductivity
英文摘要:
      electronic paste is an excellent thermal interface material (TIM), which is widely used in ultra-high speed computer chips, power semiconductor devices and LED, and it can achieve mechanical connection, electric connection and thermal connection between chip and heat sink by low temperature curing process, which can satisfy the application requirements and service conditions under high temperature. This article reviews the recent development of nano silver and carbon nanotubes application in low temperature curing electronic paste, based on the influence in thermal conductivity structure of silver nanoparticles and carbon nanotubes, separately presented: 1) the influence of the size of nano silver, surface coated agent and twins growth mode on the thermal conductivity in electronic paste; 2) the vertically aligned carbon nanotubes are prepared and the joint interface are modified and decorated, TIM was prepared to form high thermal conduction path by connecting chip and heat sink, 3) the interface influence of silver nanoparticles decorated carbon nanotubes and silver powder to prepare three-dimensional composite thermal conductive structure by sintered bonding on enhancing the thermal conductivity of electronic paste. Finally, we express the expectation for nano silver and carbon nanotubes application in improving the thermal conductivity of the electronic paste in the future.
作者单位E-mail
黄宇宽 昆明理工大学材料科学与工程学院 1220341000@qq.com 
徐顺涛) 昆明理工大学材料科学与工程学院  
甘国友) 昆明理工大学材料科学与工程学院  
李文琳) 昆明贵金属研究所 稀贵金属综合利用新技术国家重点实验室  
李俊鹏) 昆明贵金属研究所 稀贵金属综合利用新技术国家重点实验室  
摘要点击次数: 73
全文下载次数: 26
查看全文  查看/发表评论  
关闭