刘赟,俞伟元,王艳红,孙学敏.超声作用下Ni/Sn/Ni钎焊界面金属间化合物的演变[J].稀有金属材料与工程,2020,49(4):1402~1408.[Liu yun,Yu weiyuan,Wang yanhong,Sun xuemin.IMC growth at Ni/liquid Sn interface under ultrasonic treatment[J].Rare Metal Materials and Engineering,2020,49(4):1402~1408.]
超声作用下Ni/Sn/Ni钎焊界面金属间化合物的演变
投稿时间:2019-01-09  修订日期:2019-01-31
中文关键词:  超声波  金属间化合物  生长动力学  沟槽  
基金项目:国家自然科学基金资助(51465032)
中文摘要:
      本文对比研究了超声作用和无超声作用下Ni/Sn/Ni钎焊界面金属间化合物的形成和演变规律。结果表明,无超声作用时,Ni/Ni3Sn4界面较为平直且致密,而Sn/ Ni3Sn4界面被液态Sn钎料逐渐溶解而呈扇贝状,并且有少量Ni3Sn4分布在焊缝中。其次,界面IMC层厚度与时间呈抛物线关系,Ni3Sn4的生长受体扩散的控制。超声作用下,声空蚀作用使得界面Ni3Sn4发生溶解而形成很多沟槽,甚至在界面IMC的局部区域出现了“neck”状连接,重新为母材Ni原子向钎料的溶解打开了通道,在声流的辅助作用下促进母材的溶解。随着超声时间的增加,声空化作用将界面 “neck” 状连接的细长的Ni3Sn4晶粒打碎而进入焊缝,使得界面IMC逐渐减薄。进入焊缝的Ni3Sn4进一步在空化作用下溶解和破碎,最终大量细小的Ni3Sn4均匀分布在焊缝中。
IMC growth at Ni/liquid Sn interface under ultrasonic treatment
英文关键词:ultrasonic wave  intermetallic compound  growth kinetic  grooving  
英文摘要:
      The paper investigated the formation and evolution of intermetallic compound at the interface of Ni/Sn with and without USV. Without ultrasonic treatment, the IMC layer are plain and compact at the interface of Ni/Ni3Sn4. Towards the solder side, Sn tends to wet and penetrate the grain boundaries to form the scallop-type Ni3Sn4. Moreover, intermetallic grains grow with a 1/2 power dependence on time, the growth was controlled by the bulk diffusion. With ultrasonic treatment, acoustic cavitation causes the interfacial Ni3Sn4to dissolve and forms many grooves, even forms is reopened and ultrasonic streaming promotes this dissolution. With prolong of ultrasonic time, elongated Ni3Sn4grains which was "neck" connection are broken up by the ultrasonic cavitation and fall into the liquid solder. Interfacial IMC was gradually reduction. The Ni3Sn4 grains falling into the liquid are further dissolved and broken by ultrasonic cavitation. Finally many fine Ni3Sn4 grains are evenly distributed in the joint.
作者单位E-mail
刘赟 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室 liuyun86123@126.com 
俞伟元 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室 weiyuanyu2018@163.com 
王艳红 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室  
孙学敏 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室  
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