郑晓华,吴君臣,王贵葱,吴新合,沈涛,祁更新,杨芳儿.(CuO, Fe2O3)掺杂Ag/SnO2电接触材料的物理性能[J].稀有金属材料与工程,2020,49(7):2494~2500.[zheng xiao hua,wu jun chen,wang gui cong,wu xin he,shen tao,qi geng xin,yang fang er.Physical Properties of Ag/SnO2 Electrical Contacts Materials with Co-doping of CuO and Fe2O3[J].Rare Metal Materials and Engineering,2020,49(7):2494~2500.]
(CuO, Fe2O3)掺杂Ag/SnO2电接触材料的物理性能
投稿时间:2019-06-23  修订日期:2019-10-01
中文关键词:  Ag/SnO2  电接触材料  二元掺杂  热扩散  界面结合  霍尔迁移率
基金项目:浙江省重点研发计划资助项目(热熔断器专用Ag/CuO/NiO电接触材料制备关键技术及产业化, 2018C01127)
中文摘要:
      以CuO、Fe2O3为掺杂剂,采用机械合金化方法结合冷压-烧结-热压工艺制备(CuO, Fe2O3)掺杂Ag/SnO2电接触材料。利用 X 射线衍射仪(XRD)、扫描电镜(SEM)、透射电镜(TEM)、金属电阻率仪、热导率仪和霍尔效应测量仪等分析了不同掺杂比例Ag/SnO2电接触材料的微观结构和物理性能。结果表明:热压可显著改善电接触材料中SnO2颗粒与Ag基体的界面结合;CuO和Fe2O3单一掺杂可分别提高Ag/SnO2电接触材料的导电性能和导热性能,而复合掺杂的Ag-11.5SnO2-0.3CuO-0.2Fe2O3电接触材料的导电导热性能最佳,其电阻率为2.25 μΩ·cm,硬度为74.8HV0.5,在室温下的热扩散系数和热导率分别为111.4 mm2/s和338.6 W/(m·K)。复合掺杂的SnO2增强相对Ag基体的平均润湿角为62.7°,界面润湿效果好;SnO2与Ag晶粒之间界面结合良好,SnO2(200)晶面与Ag(111)晶面的界面晶格错配度为14.25%。
Physical Properties of Ag/SnO2 Electrical Contacts Materials with Co-doping of CuO and Fe2O3
英文关键词:Ag/SnO2  Electrical contact materials  Binary doping  Thermal diffusion  Interface bonding  Hall mobility
英文摘要:
      MeO-doped Ag/SnO2 electrical contact materials were prepared by mechanical alloying combined with cold pressing-sintering-hot pressing process with CuO and Fe2O3 as dopants. Microstructure and physical properities of the electrical contact materials with different dopant contents were characterized by means of X-ray diffractometry (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), metal conductivity tester, thermal conductivity meter and Hall Effect tester. The results showed that, the use of hot pressing process could significantly enhance the bonding strength between SnO2 particles and Ag matrix. Meanwhile, the single doping of CuO and Fe2O3 could improve the electrical performance and thermal conductivity of the MeO-doped Ag/SnO2 electrical contact material, respectively. When a co-doping of CuO and Fe2O3 was used, the Ag-11.5SnO2-0.3CuO-0.2Fe2O3 material presented the optimal electrical and thermal conductivity with electrical resistivity of 2.25μΩ·cm, hardness of 74.8 HV0.5, thermal diffusion coefficient of 111.4 mm2/s and thermal conductivity of 338.6 W/(m.K) at room temperature. A smaller wetting angle of 62.7° between Ag droplets and the (CuO,Fe2O3)-doped SnO2 powders was observed, indicating a better wettability, and the interfaces between SnO2 and Ag grains were well-combined with a lattice mismatch of 14.25% between SnO2 (200) and Ag (111).
作者单位E-mail
郑晓华 浙江工业大学材料科学与工程学院 zhengxh@zjut.edu.cn 
吴君臣 浙江工业大学材料科学与工程学院 1366457536@qq.com 
王贵葱 浙江工业大学材料科学与工程学院  
吴新合 温州宏丰电工合金股份有限公司  
沈涛 浙江大学材料科学与工程学院  
祁更新 温州宏丰电工合金股份有限公司  
杨芳儿 浙江工业大学材料科学与工程学院 yfe1230@163.com 
摘要点击次数: 35
全文下载次数: 28
查看全文  查看/发表评论  
关闭