张 亮,龙伟民,何 鹏,郭永环,孙 磊,姜 楠.纳米Ti颗粒对三维封装Sn互连材料组织与性能影响[J].稀有金属材料与工程,2020,49(12):4336~4340.[Zhang Liang,Long Wei-min,He Peng,Guo Yong-huan,Sun Lei,Jiang Nian.Effect of Ti nanoparticles on the microstructures and properties of Sn interconnect materials for 3D packaging[J].Rare Metal Materials and Engineering,2020,49(12):4336~4340.]
纳米Ti颗粒对三维封装Sn互连材料组织与性能影响
投稿时间:2019-12-26  修订日期:2020-02-12
中文关键词:  三维封装  纳米颗粒  力学性能  可靠性
基金项目:先进焊接与连接国家重点实验室开放课题重点项目(项目号AWJ-19Z04)和江苏省“六大人才高峰”高层次人才(项目号XCL-022)。
中文摘要:
      Sn作为三维封装芯片堆叠瞬时液相键合主要互连材料之一,本文研究了纳米Ti颗粒对三维封装Sn互连材料组织和性能的影响。结果表明:微量的纳米Ti颗粒可以提高Sn膏在铜基板表面的润湿铺展面积,显著增加Sn焊点的拉伸力和剪切力,但是过量的Ti纳米颗粒会恶化焊点的力学性能。基于Ti纳米颗粒含量优化分析证实纳米Ti颗粒的最佳添加量为0.1wt.%左右。对Cu/Sn/Cu和Cu/Sn-0.1Ti/Cu三维封装模拟件进行分析,发现Cu/Sn-0.1Ti/Cu焊点界面金属间化合物的厚度明显小于Cu/Sn/Cu,证实0.1wt.%可以显著降低金属间化合物的生长速度。 基于有限元模拟,发现0.1wt.%Ti可以显著降低三维封装互连焊点的应力-应变,提高三维封装互连焊点的可靠性。
Effect of Ti nanoparticles on the microstructures and properties of Sn interconnect materials for 3D packaging
英文关键词:3D Packaging  Nanoparticles  Mechanical Property  Reliability
英文摘要:
      Sn is one of the main interconnect materials for transient liquid phase bonding of 3D packaging chip stacking.The results show that Ti nanoparticles can improve the wetting spreading area of Sn paste on the surface of copper substrate and significantly increase the tensile force and shear force of Sn solder joint, but excessive Ti nanoparticles would deteriorate the mechanical properties of solder joint. Based on the content optimization of Ti nanoparticles, it is confirmed that the optimal addition amount of Ti nanoparticles is about 0.1wt.%. Analysis of Cu/Sn/Cu and Cu/Sn-0.1 Ti/Cu 3D packaging samples reveales that the thickness of Cu/Sn-0.1 Ti/Cu solder joint intermetallic compound is significantly lower than that of Cu/Sn/Cu, confirming that 0.1wt.% could significantly reduce the growth rate of intermetallic compound. Based on the finite element simulation, it is found that 0.1wt.%Ti can significantly reduce the stress-strain of solder joint in 3D packaging and improve the reliability of 3D interconnect joint.
作者单位E-mail
张 亮 郑州机械研究所有限公司 zhangliang@jsnu.edu.cn 
龙伟民 郑州机械研究所有限公司  
何 鹏 哈尔滨工业大学  
郭永环 江苏师范大学  
孙 磊 南京航空航天大学  
姜 楠 江苏师范大学  
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