杨超,王戎,郝娟,王迪,蒋百灵.镀料粒子脱靶方式对纯铝镀层微观组织的影响[J].稀有金属材料与工程,2021,50(1):304~310.[YANG Chao,WANG Rong,HAO Juan,WANG Di,JIANG Bailing.Effect of escape-target method of deposited particles on microstructure of pure aluminum coating[J].Rare Metal Materials and Engineering,2021,50(1):304~310.]
镀料粒子脱靶方式对纯铝镀层微观组织的影响
投稿时间:2020-01-19  修订日期:2020-03-03
中文关键词:  磁控溅射  Al镀层  熔融喷溅  组织调控  沉积速率
基金项目:国家自然No. 51571114资助
中文摘要:
      传统磁控溅射的镀料粒子碰撞溅射脱靶后具有较低的离化率和沉积动能,致使制备的纯金属镀层极易形成带有微空隙的柱状结构,降低了镀层的致密性和膜基结合力。针对此问题,在磁控溅射环境下将阴阳极间的电流提升至气体放电伏安特性曲线中的弧光放电过渡区时,受靶面晶界和缺陷处电子逸出功低于晶粒内的影响,靶面微区会形成电子逸出的自增强效应,并产生弧光放电现象。弧光放电使靶面微区熔融,该区域的镀料粒子将以熔融喷溅的方式脱靶,凭借熔融喷溅的高产额特性提高镀料粒子的碰撞离化率,为实现镀层组织的调控打下基础。实验结果发现:本研究采用高频振荡脉冲电场,在逐步提升靶电流的过程中,靶面的微观形貌会由不规则的凹坑状形貌逐渐转变为圆形熔坑和沟壑状形貌,说明镀料粒子的脱靶方式由碰撞溅射逐渐转变为熔融喷溅。靶电流为2A时,镀料粒子主要以碰撞溅射脱靶,制备的纯Al镀层呈现出典型的柱状组织,而在柱状组织间存在着微小间隙。靶电流增大至14A时,镀料粒子以熔融喷溅脱靶为主,大量离化的镀料粒子可在基体偏压电场下加速沉积,提高了镀料粒子的扩散能力,弱化了镀层柱状生长的倾向,易使镀层形成致密的组织。同时,镀层的沉积速率和膜基结合力也会有明显提升。
Effect of escape-target method of deposited particles on microstructure of pure aluminum coating
英文关键词:magnetron sputtering  aluminum coating  melt splashing  structure regulation  deposition rate
英文摘要:
      :For traditional magnetron sputtering, the sputtered species possessed low kinetic energy and ionization rate, which give rise to the metal coating formed columnar structure with micro pores, the coating therefore has poor compactness and adhesion strength. Aiming at this problem, the electric current through the anode and cathode was adjusted into the arc discharge transition region between the glow region and arc region of the gas discharge voltammetry curve in plasma physics. The escape energy of electron at the grain boundary and defect of the target is lower than that inside the grain, then theself-enhancing effectof electron escape is formed in grain boundary which induces the arc discharge phenomenon. Arc discharge melts some micro regions of the target surface, the plating particles in these regions will leave the target in the form of melt splashing. The high yield of melt splashing can improve the collisional ionization rate of the plating particles, which establish a foundation for the control of the coating structure. Experimental results show that: In the case of high frequency oscillating pulsed electric field, when the target current was gradually increased, the micro-morphology of the target surface gradually changed from Irregular pit-like morphology to round pit and curved ravine morphology, indicating that the off-target mode of the plating material changed from collision sputtering to melt splashing. When the target current was 2A, the species left the target by means of collision sputtering. The microstructure of the aluminum coating presented typical columnar structure with voids. When the target current increased to 14A, the off-target mode of the target particles was mainly melt splashing, massive ionized plating particles were accelerated under the negative bias of substrate. These ions with high kinetic energy enhanced bulk diffusion and weakened the tendency for column growth,which helped the coating form a dense structure. At the same time, the adhesion and the deposition rate of the coating were also significantly improved.
作者单位E-mail
杨超 西安理工大学材料科学与工程学院 西安 710048 yangch@xaut.edu.cn 
王戎 西安理工大学材料科学与工程学院 西安 710048 252611183@qq.com 
郝娟 西安理工大学材料科学与工程学院 西安 710048  
王迪 西安理工大学材料科学与工程学院 西安 710048  
蒋百灵 西安理工大学材料科学与工程学院 西安 710048  
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