姜楠,张亮,孙磊,王凤江,龙伟民,钟素娟.热循环对Sn58Bi(纳米Ti)/Cu焊点界面与性能影响[J].稀有金属材料与工程,2021,50(1):327~332.[Jiang Nan,Zhang Liang,Sun Lei,Wang Fengjiang,Long Weimin,Zhong Sujuan.Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints[J].Rare Metal Materials and Engineering,2021,50(1):327~332.]
热循环对Sn58Bi(纳米Ti)/Cu焊点界面与性能影响
投稿时间:2020-02-10  修订日期:2020-04-18
中文关键词:  Sn-58Bi无铅钎料  Ti纳米颗粒  界面反应  热循环  扩散系数
基金项目:国家自然科学基金资助项目(51475220);先进焊接与连接国家重点实验室开放课题重点项目(AWJ-19Z04);江苏省“六大人才高峰”资助项目(XCL-022)
中文摘要:
      为了改善Sn-58Bi低温钎料的性能,通过在Sn-58Bi低温钎料中添加质量分数为0.1%的纳米Ti颗粒制备了Sn-58Bi-0.1Ti纳米增强复合钎料。在本文中,研究了纳米Ti颗粒的添加对-55~125 oC热循环过程中Sn-58Bi/Cu焊点的界面金属间化合物(IMC)生长行为的影响。研究结果表明:回流焊后,在Sn-58Bi/Cu焊点和Sn-58Bi-0.1Ti/Cu焊点的界面处都形成一层扇贝状的Cu6Sn5 IMC层。在热循环300次后,在Cu6Sn5/Cu界面处形成了一层Cu3Sn IMC。Sn-58Bi/Cu焊点和Sn-58Bi-0.1Ti/Cu焊点的IMC层厚度均和热循环时间的平方根呈线性关系。但是,Sn-58Bi-0.1Ti/Cu焊点的IMC层厚度明显低于Sn-58B/Cu焊点,这表明纳米Ti颗粒的添加能有效抑制热循环过程中界面IMC的过度生长。另外计算了这两种焊点的IMC层扩散系数,结果发现Sn-58Bi-0.1Ti/Cu焊点的IMC层扩散系数(整体IMC、Cu6Sn5和Cu3Sn IMC)明显比Sn-58Bi/Cu焊点小,这在一定程度上解释了Ti纳米颗粒对界面IMC层的抑制作用。
Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints
英文关键词:Sn58Bi solder  Ti nanoparticles  interfacial reaction  thermal cycle  diffusion coefficient
英文摘要:
      In order to improve the performance of Sn-58Bi lead-free solder, the Sn-58Bi-0.1Ti nanometer reinforced composite solder was prepared by incorporating 0.1% Ti nanoparticles into the Sn-58Bi solder. In this paper, the effect of adding Ti nanoparticles on the growth behavior of intermetallic compounds (IMC) in Sn-58Bi/Cu solder joints during thermal cycling was studied. The results showed that a scallop-like Cu6Sn5 IMC layer was formed at Sn-58Bi /Cu and Sn-58Bi-0.1Ti/Cu interface after reflow soldering. After 300 thermal cycles, a layer of Cu3Sn IMC was formed at the Cu6Sn5/Cu interface. The thickness of IMC layer of Sn-58Bi/Cu solder joint and Sn-58Bi-0.1Ti/Cu solder joint is proportional to the square of thermal cycling time. However, the IMC thickness of Sn-58Bi-0.1Ti/Cu solder joint is significantly lower than that of Sn-58B/Cu solder joint, which indicated that the addition of Ti nanoparticles can effectively inhibit the excessive growth of interfacial IMC during the thermal cycle process. In addition, the IMC layer diffusion coefficients of these two solder joints were calculated, and it was found that the diffusion coefficients of IMC layer in Sn-58Bi-0.1Ti/Cu solder joint (overall IMC, Cu6Sn5 and Cu3Sn IMC) were smaller than that of Sn-58Bi/Cu solder joint, which explained the inhibitory effect of Ti nanoparticles on the interface IMC layer to some extent.
作者单位E-mail
姜楠 江苏师范大学 机电工程学院 jiangnan2972@163.com 
张亮 江苏师范大学 机电工程学院 zhangliang@jsnu.edu.cn 
孙磊 南京航空航天大学 直升机传动技术国家重点实验室 sunlei956@162.com 
王凤江 江苏科技大学材料科学及工程学院  
龙伟民 郑州机械研究所 新型钎焊材料与技术国家重点实验室  
钟素娟 郑州机械研究所 新型钎焊材料与技术国家重点实验室  
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