In this paper, the effective connection between kovar alloy 4J29 and float glass was realized by using ALTSAB technology and SnAg3.5Ti2 solder. The effects of voltage and temperature on the interface microstructure and shear strength were studied, and the mechanism of bonding formation was explored. The results show that: with the increase of voltage and temperature, the interface between glass and solder has no significant change, new chemical bonds ≡Si-O-Ti and ≡Si-O-Sn are formed at the interface, and TiO and SnO are formed by oxidation reaction; there is reaction dissolution phenomenon between solder and alloy side, FeSn₂ phase is formed at the kovar alloy side.There are some slender rod-shaped and needle-like Ni₃Sn₄ phases in the solder. It is considered that the formation of sodium ion depletion layer and the diffusion of Ti^₂₊ and Sn^₂₊ into the glass matrix are the key to the formation of effective bonding. The maximum shear strength is 12.5Mpa when the voltage is 1000V and the temperature is 400 ℃.