This study addresses the current lack of brazing materials suitable for low-temperature brazing of AlN ceramics and Al. By adding In and Sn elements to AgCuTi brazing materials to lower their melting points, new low-temperature brazing materials AgCu28In35Ti2 and Sn48.15Ag19Cu14.35In17.5Ti1 were prepared to achieve good bonding of AlN/Al joints. Explored the low-temperature brazing process, joint microstructure and properties of AlN ceramics and Al using two types of brazing materials. Research has shown that SnAgCuInTi brazing materials form relatively stable compounds such as InSn3 and Al3Ti at the solder joints. AgCuInTi brazing material generates relatively stable compounds such as Al2Cu, AgIn2, and TiAl3 at the solder joint, and the joint strength increases with the increase of welding temperature. To prevent the diffusion and precipitation of In, Ni plating was chosen on the surface of Al, but Ni plating reduced the thermal conductivity of the joint. It was found that using AgCu28In35Ti2 brazing material for welding resulted in the highest joint strength of 20.28MPa at 640 ℃ for 30 minutes; Under the condition of 620 ℃ for 15 minutes, the thermal diffusion coefficient can reach 65.941 m2/s. This brazing material provides a new method for highly reliable connection of AlN ceramics/Al.