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纯铜粘结剂喷射增材成形与烧结致密化机理研究
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作者单位:

1.华南理工大学;2.广州雷佳增材科技有限公司

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基金项目:

国家重点研发计划(2024YFB4608600);广东省重点领域研发计划(2018B090905002)


Research on the mechanism of pure copper binder jetting additive forming and sintering densification
Author:
Affiliation:

1.South China University of Technology;2.Guangzhou Leijia Additive Technology Co., Ltd

Fund Project:

National Key Research and Development Program of China(No. 2024YFB4608600); The Science and Technology Planning Project of Guangdong Province (No. 2018B090905002)

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    摘要:

    粘结剂喷射增材制造技术打印过程与脱脂烧结工艺过程分步进行,可以实现高激光反射率高导热性的纯铜加工成形。对纯铜粘结剂喷射增材制造工艺参数进行了研究。研究了铺粉层厚与喷墨密度对生坯成形性能的影响。同时,研究了烧结氛围与烧结温度对零件烧结致密化过程的影响,对比真空环境与氢气气氛烧结。结果表明,铺粉层厚75μm,喷墨密度50%参数组合在保证生坯密度与压缩强度的前提,具备高尺寸精度与高表面质量。氢气气氛烧结驱动力显著强于真空环境,氢气的引入可以有效还原表面氧化层。1060℃致密度77.70%,碳残留物形成孔隙抑制烧结过程致密化,1070℃致密度93.94%,试样严重变形碳残留物挤压至表面。这为进一步优化纯铜粘结剂喷射增材制造工艺指明了方向。

    Abstract:

    The printing process and the debinding sintering process are carried out step by step, which can realize the pure copper processing with high laser reflectivity and high thermal conductivity. The process parameters of pure copper binder jetting additive manufacturing were studied. The effects of powder layer thickness and inkjet density on green parts forming performance were studied. At the same time, the effects of sintering atmosphere and sintering temperature on the densification process of the parts were studied. The results show that the combination of powder layer thickness of 75μm and inkjet density of 50% can ensure the density and compression strength of green parts, and have high dimension precision and high surface quality. The driving force in hydrogen atmosphere is stronger than that in vacuum, and the surface oxide layer can be effectively reduced by the introduction of hydrogen. The density of 1060°C was 77.70% , the carbon residue formed pores to restrain the sintering process, and the density of 1070°C was 93.94% . It points out the direction for further optimizing the manufacturing process of binder jetting with pure copper.

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吕少波,杨永强,王迪,刘林青,吴世彪,张世钦,姜飞.纯铜粘结剂喷射增材成形与烧结致密化机理研究[J].稀有金属材料与工程,,().[Lv Shaobo, Yang Yongqiang, Wang Di, Liu Linqing, Wu Shibiao, Zhang Shiqin, Jiang Fei. Research on the mechanism of pure copper binder jetting additive forming and sintering densification[J]. Rare Metal Materials and Engineering,,().]
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  • 收稿日期:2024-12-24
  • 最后修改日期:2025-01-21
  • 录用日期:2025-02-21
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