邹建雄,林黎蔚,焦国华,鲁远甫,刘波,许可为.铜互连微结构无籽晶RuMoC扩散阻挡层稳定性研究[J].稀有金属材料与工程,2019,48(6):1809~1813.[Zou Jian Xiong,Lin Li Wei,Jiao Guo Hua,Lu Yuan Fu,Liu Bo,Xu Ke Wei.Characterization of thermal stability of RuMoC films as seedless Cu diffusion barriers in damascene structures for Cu interconnects[J].Rare Metal Materials and Engineering,2019,48(6):1809~1813.]
铜互连微结构无籽晶RuMoC扩散阻挡层稳定性研究
投稿时间:2018-01-18  修订日期:2018-03-06
中文关键词:  热稳定性  大马士革结构  非晶RuMoC薄膜  无籽晶阻挡层
基金项目:国家自然科学基金项目 Nos.11605116,深圳市科技计划项目 Nos.JCYJ20150925163313898 和 JCYJ20140417113130693以及深圳市工程实验室项目No.2012-1127
中文摘要:
      采用磁控共溅射Ru和MoC靶,通过调节掺入MoC的含量获得非晶态RuMoC薄膜,研究了非晶RuMoC薄膜的热稳定性。HRTEM和XRD结果表明,在500℃下RuMoC薄膜依旧保持非晶结构;XPS分析结果表明,在该温度下,Ru-C键依旧保持完好,是RuMoC薄膜良好热稳定的关键。此外,研究了RuMoC在大马士革铜互连线微结构中的热稳定性。HRTEM结果表明,RuMoC薄膜实现直接电镀铜,TEM原位EDS结果表明,RuMoC薄膜在500℃下依旧成功阻挡了Cu原子扩散。
Characterization of thermal stability of RuMoC films as seedless Cu diffusion barriers in damascene structures for Cu interconnects
英文关键词:thermal stability  damascene structures  amorphous RuMoC film  seedless diffusion barrier  
英文摘要:
      The objective of this study is to test the feasibility of RuMoC films for its application in seedless Cu diffusion barriers of damascene structure. The compatibility with IC fabrication and thermal stability of RuMoC barriers were investigated. The RuMoC barriers were amorphous at temperatures up to 500 ℃, showing great thermal stability. This is because the Ru-C bonds were well preserved at those temperatures, as revealed by XPS results, which hindered the Ru from crystallizing. A Cu plug of good quality was successfully electroplated on RuMoC barriers and filled the trench without seed layer, and the barrier effectively blocked the diffusion of Cu atom at temperatures up to 500 ℃. The results indicated a great prospect of RuMoC film as seedless Cu diffusion barrier in damascene structure for Cu interconnect.
作者单位E-mail
邹建雄 四川大学原子核科学技术研究所教育部辐射物理及技术重点实验室 hua_die_feng@163.com 
林黎蔚 四川大学原子核科学技术研究所教育部辐射物理及技术重点实验室  
焦国华 中国科学院深圳先进技术研究院  
鲁远甫 中国科学院深圳先进技术研究院  
刘波 四川大学原子核科学技术研究所教育部辐射物理及技术重点实验室  
许可为 西安交通大学金属材料强度国家重点实验室  
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