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HIP Diffusion Bonding of Cemented Carbide to Steel
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TG453.9

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    Abstract:

    he technology of the HIP diffusion bonding of YG 15C cemented carbide to 45# carbon steel has been studied. The effects of bonding temperature. pressure time.interlayer and its thickness. residual thermal stress on bonding strength have been researched. The results show that: In the HIP diffusion bonding of YG 15C to 45# carbon steel, the bonding strength depends on bonding temperature strongly and is controlled by the residual thermal stress d ne to the therm al expansion mismatch after honding. By using N i asinterlayer, the effect of residual thermal stress on bonding can be diminished effectively sothat the bonding strength can be improved apparently.

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[Chen Feixiong, Li Shikui. HIP Diffusion Bonding of Cemented Carbide to Steel[J]. Rare Metal Materials and Engineering,1994,(4):46~51.]
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