Electroless Plating Improving the Bending Strength of Copper Graphite Material

Home > Archive>Volume , Issue 3, 1998 >182-185

Electroless Plating Improving the Bending Strength of Copper Graphite Material
DOI:
                        
                    
Author:
                        Li Yawen,Ding Huadong,Hao Hongqi,Jin ZhihaoLi Yawen,Ding Huadong,Hao Hongqi,Jin Zhihao

Find this author on All Journals
Find this author on BaiDu
Search for this author on this site

                    
Affiliation:
Clc Number:TF125.6
Fund Project:

Article

Figures

Metrics

Reference

Cited by

Materials

Comments

Get Citation

[Li Yawen, Ding Huadong, Hao Hongqi, Jin Zhihao. Electroless Plating Improving the Bending Strength of Copper Graphite Material[J]. Rare Metal Materials and Engineering,1998,(3):182~185.]
DOI：[doi]

Copy

Article Metrics

Abstract:
PDF:
HTML:
Cited by:

History

Received:
Revised:
Adopted:
Online:
Published:

Home

Introduction

Editorial Board

Submission Guideline

Contact Us

中文

Get Citation

Article Metrics

History