Optimum Design of W/Cu Functionally Graded Material for Thermal Stress Mitigation
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[Ling Yunhan, Bai Xinde, Li Jiangtao, Ge Changchun. Optimum Design of W/Cu Functionally Graded Material for Thermal Stress Mitigation[J]. Rare Metal Materials and Engineering,2003,(12):976~980.] DOI：[doi]