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The Study on the New Type Lead-Free Solder Alloys Sn-Zn-Ga
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TN05

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    Abstract:

    The character of Sn-Zn-Ga solder alloy, including a series of properties tests, such as melting point, hardness, shear strength and solderability was studied. The results show that Ga element can decrease the melting point of solder alloys, but increase the melting range, and also reduce the hardness and shear strength of solder alloys. In addition, Ga element can enhance the wetting ability of solder alloys. The best composition of Sn-Zn-Ga lead-free solder alloy was obtained.

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[Chen Guohai, Li Xiaoyan, Geng Zhiting, Ma Jusheng. The Study on the New Type Lead-Free Solder Alloys Sn-Zn-Ga[J]. Rare Metal Materials and Engineering,2004,33(11):1222~1225.]
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  • Received:
  • Revised:March 29,2003
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