Study of a New Type of Au-Ag-Si Intermediate Temperature Eutectic Solder
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[Mo Wenjian, Wang Zhifa, Jiang Guosheng, Wang Haishan. Study of a New Type of Au-Ag-Si Intermediate Temperature Eutectic Solder[J]. Rare Metal Materials and Engineering,2005,34(3):497~500.] DOI：[doi]