Interfacial Reaction of Ti as Interfacial Binder in SiCf/Cu Composites
DOI:
Author:
Affiliation:
Clc Number:
TG146.4
Fund Project:
Article
|
Figures
|
Metrics
|
Reference
|
Related
|
Cited by
|
Materials
|
Comments
Abstract:
Reference
Related
Cited by
Get Citation
[Luo Xian, Yang Yanqing, Huang Bin, Li Jiankang, Yuan Meini, Chen Yan. Interfacial Reaction of Ti as Interfacial Binder in SiCf/Cu Composites[J]. Rare Metal Materials and Engineering,2008,37(3):517~520.] DOI：[doi]