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Solidification Distance of Planar Interface and Interface Instability in Directional Solidification of Cu-Cr Alloy
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TG113

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[Li Xiaoli, Li Jinshan, Tang Ling, Hu Rui, Kou Hongchao, Fu Hengzhi. Solidification Distance of Planar Interface and Interface Instability in Directional Solidification of Cu-Cr Alloy[J]. Rare Metal Materials and Engineering,2008,37(4):613~616.]
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  • Received:
  • Revised:March 21,2007
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