Mo-15Cu sheets of 90.5% relative density were cold-rolled with deformation by 70% and 90% and then resintered at 1200 oC for 1 and 1.5 h. The microstructure change and XRD patterns of the sheets before and after resintering were analyzed. The thermal conductivity, electrical resistivity and thermal expansion coefficient of the sheets rolled and sintered were measured. Results show that the microstructure defects of the cold-rolled sheets were eliminated significantly by resintering. The thermal conductivity of 70% deformed sheet after resintering was 154.5 W(m·K)-1, electrical resistivity was 4.48 μΩ·cm, and the thermal expansion coefficient was 6.31×10-6 K–1. It is concluded that the resintering technology can improve greatly the microstructure and physical performances of cold-rolled Mo-15Cu sheets to meet the demands of electronic packaging materials