The ability to control the uniformity of electrodeposition is the key to successful application of electrodeposition technology such as electroplating and electroforming. The principle of micro-electroforming is briefly introduced. The latest research progresses of the thickness uniformity of micro-device electrodeposition at home and abroad are summarized, including optimization of parameters in electrodeposition, modification of current density and application of modulated current, metal ion transportation, auxiliary cathode, shields and baffles, careful control of anode properties, numerical simulation. A new electroplating method in supercritical carbon dioxide and its advantages are presented in detail. Finally, the research focus and future aspects about the uniformity are proposed.