The silver-coated copper powder with high silver content, a silver layer of certain thickness and high density was prepared by chemistry plating reaction. The surface morphology, structure and conductivity of the coated powder and the initial powder were characterized by SEM, XRD, LSPSDA, DOM and TG-DTA. Results show that the surface of the silver-coated copper power with high silver content is dense and coated completely, and the coating thickness is up to 336 nm. The powder has good conductivity and oxidation resistance.