Xiao Hui
Beijing University of Technology, Beijing 100124, ChinaNational Natural Science Foundation of China (50871004); Beijing Natural Science Foundation (2112005); Beijing Nature Science Foundation (2082003)
[Xiao Hui, Li Xiaoyan, Yan Yongchang, Liu Na, Shi Yaowu. Damage Behavior of SnAgCu Solder under Thermal Cycling[J]. Rare Metal Materials and Engineering,2013,42(2):221~226.]
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