Vacuum diffusion bonding of TiC cermet/304 stainless steel was conducted and Ti-Nb-Cu multi-interlayer was intended to achieve active bonding and residual stress relieving. Detailed microstructure characterization and mechanical properties assessment was carried out to evaluate the bonding technology. It was found that an obvious transition zone was formed at the interfaces and the detailed interfacial products were (Ti,Nb), remnant Nb, remnant Cu and Cu(s.s). The shear strength of TiC/Ti-Nb-Cu/304SS joint up to 84.6 MPa by controlling heating to 925℃ and hold for 20 min under a pressure of 8MPa. Failure occurred within TiC cermet near the interface in a brittle manner. The results indicated that Ti/Nb/Cu can be effectively reduce the harmful effects of intermetallic compounds on the joint performance, and the Nb interlayer plays a major role in the relief of the residual stress.