Selecting appropriate wall material is the key to reduce the consumption of precursor in the hot wall chemical vapour deposition process that is used to prepare platinum films so that the partial press of precursor could be maintained. The ease of Pt fimls deposition was compared in this paper. The compared substrates were nickel-based superalloy, copper with oxide layer for the candidate of depositon chamber material and pure copper. The result shows that the copper with oxide layer is the hardest deposited in these experiments. Although the copper with oxide layer could be used as the substrate material in hot wall CVD, it can be only used one time.