High strength and high conductivity Cu-Nb microcomposites were fabricated by accumulated bundling and drawing process. The crystal orientation and morphology of Cu-Nb materials were investigated by means of X-ray diffraction and scanning electron microscopy. The stress-strain curves and conductivity of samples at different HT condition were measured. It is indicated that recrystallization textures are formed after HT at 700℃. Chemical potential difference and atomic diffusion caused by serve plastic deformation are key factors of interface stability. And even intermediate HT at 700℃ will be benefit for the mechanical properties of Cu-Nb microcomposites. It is believed that low temperature adjustment could improve the plasticity and keep the strength.