Ti-TiN-Zr-ZrN multilayer films were deposited on TC11 titanium alloy and Si wafer by vacuum cathodic arc ion plating technology. The Ti-TiN-Zr-ZrN multilayer films with different modulation periods, different R_Ti/TiN:R_Zr/ZrNmodulation ratio and different thickness. The structure and performance of the multilayer films, especially residual stress were investigated by various analytical methods including scanning electron microscopy (SEM), X-ray diffraction(XRD), micro-hardness tester, scratch adhesion tester and stress gauge. The results show that increasing the modulation period, residual stress decreased, adhesive strength and hardness were increased. Reduce the modulation of RTi/TiN:RZr/ZrN modulation ratio, is residual stress and hardness increases, the adhesive strength decreased. Increasing the thickness of multilayer films, residual stress increased slightly, adhesion and hardness are improved. the film’s hardness around at 30Gpa when it’s thickness up to 7.54μm.