Cu-3.2Ni-0.7Si (wt%) alloy ribbons were prepared by single roller melt-spinning at different rotating speeds. The influences of cooling rate and aging on the electronic conductivity and mechanical properties of Cu-3.2Ni-0.7Si (wt%) alloy were investigated. The refinement of the solidified microstructures is distinctly observed with increasing of the cooling rate, which is responsible for the decrease of the electronic conductivity and increase of the microhardness and the tensile strength. During aging of the as-quenched alloy at a temperature, the electronic conductivity increases with lengthening of the aging time. However, the tensile strength and the microhardness first increase with lengthening of the aging time, and then decrease after reaching peak values. The considerable decrease of the electronic conductivity with increasing of cooling rate is due to the severe lattice distortion. However, the electronic conductivity considerably increases due to aging, which is attributed to the recovery of the distorted lattices. The increases of the microhardness and the tensile strength of the as-quenched alloy are due to the strengthening effect of refinement. The increases of the microhardness and the tensile strength due to aging are attributed to the strengthening effect of the randomly distributed second phase in the matrix. However, the microhardness and the tensile strength tend to decrease after reaching peak values with lengthening of the aging time, which is due to the growth and agglomeration of the precipitated second phase.