Microstructure evolution and fracture modes of Be/CuCrZr joints with 50μm Ti interlayer by hot isostatics pressing bonding at high temperature (780 ℃ ~ 850 ℃) and different time (0.5 h ~2 h) were studied by mean of EPMA. The results show that forming process of intermetallic compounds at Be/Ti and Ti/CuCrZr interfaces conformed to Flux-Energy law. The diffusion rate of Be in Ti is greater than that of Cu in Ti. But the Ti-Cu-Be ternary intermetallic compound with high Be content formed in the Be/Ti interface reaction zone is very brittleness, which caused the property deterioration of the Be/CuCrZr joint. By contrast, the Ti-Cu-Be ternary intermetallic compounds with low Be content formed in the Ti/CuCrZr interface reaction zone have relatively little influence on Be/CuCrZr joint properties. HIP conditions affected significantly on Be/CuCrZr joint properties. The Be/CuCrZr joint bonded by HIP under 800 ℃, 2 h and130 MPa provided with optimum properties, and tensile strength is up to 122.8 MPa. The joint exhibited the good bonding interface without hot cracks, and the fracture of the joint is caused by cleavage fracture of Be12Ti+Be10Ti mixed intermetallic compound layer.