Jiang Bo
University of Science and Technology BeijingRen Xueping
University of Science and Technology BeijingHan Yujie
AVIC Manufacturing Technology InstituteHou Hongliang
AVIC Manufacturing Technology InstituteWang Yaoqi
AVIC Manufacturing Technology InstituteZhang Yanling
AVIC Manufacturing Technology Institute1.University of Science and Technology Beijing;2.AVIC Manufacturing Technology Institute
[Jiang Bo, Ren Xueping, Han Yujie, Hou Hongliang, Wang Yaoqi, Zhang Yanling. Analysis of the peel strength and bonding mechanism of Ti/Al foil interface using ultrasonic consolidation process[J]. Rare Metal Materials and Engineering,2019,48(10):3372~3378.]
DOI:10.12442/j. issn.1002-185X.20180624