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Investigation of microstructure and thermophysical properties of hot-pressed CuFeCoCr composite
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College of Materials and Fujian Provincial Key Laboratory of Materials Genome,Xiamen University,Xiamen

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National Natural Science Foundation of China (Grant Nos. 51471138)

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    Abstract:

    In this paper, series micro-scale powders with composite microstructure in CuFeCoCr system were successfully designed and fabricated by using CALPHAD (Calculated of Phase Diagrams) approach and gas atomization method, respectively. The bulk CuFeCoCr composites were produced by hot pressing technique at 950℃ under a pressure of 45MPa. The effect of Cu content on the microstructure, coefficients of thermal expansion (CTE), thermal conductivity (TC) and micro-hardness (HV) were systematically studied. The results show that the CuFeCoCr composites present two separate fcc phases (Cu-rich and FeCrCo-rich phase) microstructure. After annealing at 500 °C for 8 h, the CTE of the composites ranged from 5.75 to 11.45×10-6 K-1 and TC varied from 42.2 to 107.4 W.m-1.K-1. Particularly, the Cu55(Fe0.37Cr0.09Co0.54)45 composite exhibits excellent comprehensive properties, i.e. CTE of 6.88×10-6 K-1 and TC of 91.09 W.m-1.K-1,which matches with the semiconductor in electronic packaging. In addition, all the prepared composites exhibit a higher HV than that of Cu/Invar composite.

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[Xingjun Liu, Jiahua Zhu, Zhoufeng He, Jinbin Zhang, Shuiyuan Yang, Jiajia Han, Yong Lu, Cuiping Wang. Investigation of microstructure and thermophysical properties of hot-pressed CuFeCoCr composite[J]. Rare Metal Materials and Engineering,2020,49(2):422~428.]
DOI:10.12442/j. issn.1002-185X.20180956

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History
  • Received:September 13,2018
  • Revised:October 04,2018
  • Adopted:October 24,2018
  • Online: March 12,2020
  • Published: